|
|
Build Your Online Product Catalogs?
Features:
1.BGA rework station, Infrared one.
2.Two independent heating zones, multitude temperature zones control, lead free process.
3.Top heating zone use to infrared
4.The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
5. Six-section temperature controls, simulates re-flower effect completely.
6.Cools PCB after heating, to prevent PCB deflection.
7.BGA welding on completion of the demolition, a voice prompt.
8.Vacuum wand sucks BGA, convenient, reliable and durable.
9.Card board with a special tooling for a wide variety of notebook motherboard(option )
10. COM connection, connect with computer to achieve hi-end rework function.
Specifications:
Solder Type:Normal Solder/Lead free
SMD:µBGA,BGA,CSP,QFP
Thickness:0.5~4mm
PCB Size:MAX 250mmW*200mmL
Heating/Consumption(Upper):IR/300W
Heating/Consumption(Bottom):IR/1200W
Control:Have COM ,can connect PC
Max Consumption:1.6KW
Power:220V OR 380V OR 110V
Dimension:300mmL X 400mmW X 300mmH
Weight:14Kg
Package: Carton
|
| Company: |
Forestall Exact Equipment Co., Ltd
|
| Contact: |
Ms. Shirley Wong |
| Address: |
Building A, The Second Industrial |
| Postcode: |
518104 |
| Tel: |
0755-29697235 |
| Fax: |
0755-29691240 |
| E-mail: |
|
|
|
|
Home
